Reason for action: Shanghai Semicon Hub and Dutch Excellence
For both China and the Netherlands, the semiconductor sector represents a significant part of the domestic innovative ecosystem. The value chain in the Netherlands is one of the globally most competitive, due to a tight interaction between universities, engineering schools and businesses. International talents work together on both established and novel concepts in this industry, where they closely integrate in an international network of excellence. The Dutch semiconductor expertise is strongest in design and equipment.
Based on growing demands and a highly skilled engineering workforce, China is rapidly ramping up its semiconductor ecosystem by increasing domestic production, broadening expertise, and developing domestic design skills. Linking to international partners in order to connect with the state-of-the-art knowledge and expertise is crucial in this development.
We would like to welcome you to participate in our seminar/networking event, to find opportunities to work together with globally operating equipment builders, design houses and the most prominent Dutch branch organization in this sector, the Business Cluster Semiconductors.
14:00 Opening remarks
Mr. Taake Manning; Counsellor for Innovation, Technology & Science, Dutch Embassy
14:05 Introduction of all participants
14:15 Presentation: Business Cluster Semiconductors
Mr. Barry Peet; Director
14:30 Presentation: Holland High-Tech Center China
Mr. Ronnie Li, General Manager
14:45 Presentation: EU China Research and Innovation Co-funding Mechanism
Mr. Philipp Barth; Head of Communication Networks, Content & Technology, EU Delegation to China
15:15 Presentation: Semiconductor Industry of China
Dr. Daoguo Yang; Guilin University of Electronic Technology
15:45 Discussion and conclusions
All participants are invited to join for a get-together and informal networking after the seminar.
Location: Consulate-General of the Kingdom of the Netherlands
10/F Tower B, Dawning Center, 500 Hongbaoshi Rd. | Changning district, Shanghai 201103
荷兰王国驻沪总领事馆科技与创新处 | 上海市长宁区红宝石路500号 | 东银中心B塔10楼 201103
Mr. Taake Manning studied Applied Mathematics and Philosophy of Science and Technology at Twente University. After graduation he worked as an IT consultant for a few years. In 2001 he joined the predecessor of Netherlands Enterprise Agency (Rijksdienst voor Ondernemend Nederland in Dutch), the implementation agency of the Ministry of Economic Affairs in the Netherlands. He has been involved in the implementation of International Research & Development cooperation policy ever since. Taake was the Dutch representative in the Eureka network and the NCP network of the EU Framework Programme. He has been involved in the Dutch Chairmanship of Eureka and in creating new European programmes such as Eurostars. Due to his long experience in international technology cooperation he has an extensive network within industry, academia and government organisations in Europe. As of January 2015 he is the Science & Technology Counsellor at the Dutch Embassy in Beijing.
Mr. Barry Peet has a Master’s degree in Electronic Engineering. He has 12 years of experience in running his own mobile ICT company, were he was responsible – as founder and COO – for sales, project management and managing the software development team.
Mr. Peet is now managing director of Business Cluster Semiconductors Netherlands (BCS), the Dutch semicon cluster that supports a total of almost 60 companies and knowledge institutes and strives to achieve competitive advantages for companies active in the development, production and application of Advanced ICs, MEMS, Sensors and Wireless Systems by collaboration.
Mr. Ronnie Li has two Bachelor’s degrees in Business Administration and Petroleum Engineering. During his working experience, Mr. Li came across a wide range of disciplines from civil engineering to microelectronics, and different managing roles from running production facility to regional representative for sales and marketing, from director of liaison office connecting governmental agencies to deputy secretary general for professional organizations in the semiconductor industry.
Mr. Li is now the operation director of Holland High Tech China Center, a platform with its aim and purpose to help Dutch SMEs in high tech field to facilitate the trade and technology transfer with his counterparts in China.
Mr. Philipp Barth is the Head of the CONNECT Section at the EU Delegation to China, representing the European Commission’s Directorate-General CONNECT (Communications Networks, Content & Technology) and with a policy dossier including RDI cooperation, market access questions in the ICT sector as well as Internet Governance. Before taking up duty in Beijing he worked at DG CONNECT in Brussels focusing in particular on policy around Smart Cities and was involved in the set-up of an Innovation Partnership and a Horizon 2020 Focus Area on this topic. His background prior to joining the Commission was in strategy consulting in the GSA’s ICT and telecoms sectors. His university education was at Cambridge (Peterhouse and St John’s College) in philosophy.
Dr. Daoguo Yang is currently a professor and the dean of the School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, China. He is also the director of Research Center for Microelectronics Packaging and Assembly of GUET, and he was appointed as Distinguished Expert of Guangxi Province in 2011. He received his Master degree from Zhejiang University, China, and Ph.D. from Delft University of Technology, the Netherlands. After his doctoral research, he has worked as post-doctoral research fellow for two years in TUDelft. Afterwards, he joint Philips Semiconductors (NXP Semiconductors), the Netherlands and worked as a Principal Engineer and project leader.
Dr. Yang has over twenty years of working experience in the filed of electronics packaging and assembly. His scientific interests are mainly in microelectronics and Microsystems packaging and assembly technologies, LED packaging and system integration, reliability analysis, numerical and experimental mechanics. He has authored or co-authored over 100 scientific publications, including 40 journal papers and over 60 conference papers, three book chapters and two European patents. He was the chair of the technical committee of the 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2012). He served as Co-Chair of the organizing committee for the International Conference on Electronic Packaging Technology (ICEPT) since 2013. He is the technical committee member of EuroSimE and EPTC. He was invited to present several keynote speeches in international conferences.